With the development of technology and the upgrading of electronic products, single-sided PCBs have been unable to meet the demand, and the use of multilayer PCBs is growing. In the manufacture of multilayer PCBs, lamination is a very important process and it is necessary to understand it.Get more news about oem pcb prototype manufacure,you can vist our website!
Lamination, as the name implies, is the process of bonding layers of thin layers into a single unit. The whole process includes kiss pressure, full pressure and cold pressure. During the kiss pressure phase, the resin wets the bonding surface and fills the voids in the line, then enters full pressure to bond all voids. The so-called cold pressing is to make the circuit board cool quickly and keep the size stable.
The lamination process requires attention. First of all, in the design, the inner core board must meet the lamination requirements, mainly the thickness, the outer dimensions, the positioning holes, etc., which need to be designed according to the specific requirements, and the inner core board as a whole. No open, short, open circuit, no oxidation, no residual film.
Secondly, when the multi-layer board is laminated, the inner core board needs to be processed, and the treatment process has black oxidation treatment and browning treatment. The oxidation treatment forms a black oxide film on the inner layer copper foil, and the browning process forms an organic film on the inner layer copper foil.(Printed circuit board in china )
Finally, when laminating, you need to pay attention to the three major problems of temperature, pressure and time. The temperature is mainly concerned with the melting temperature and curing temperature of the resin, the set temperature of the hot plate, the actual temperature of the material, and the change in the temperature of the temperature rise.
These parameters need attention. As for the pressure, it is the basic principle to fill the interlayer voids with resin and drain the interlayer gases and volatiles. The time parameters are mainly the control of the pressurization timing, the control of the temperature rise timing, and the gel time
Sponsored
Lamination process of PCB multilayer board
Posted 2023-01-14 03:07:40
0
119
Search
Sponsored
Categories
- Art
- Causes
- Crafts
- Dance
- Drinks
- Film
- Fitness
- Food
- Games
- Gardening
- Health
- Home
- Literature
- Music
- Networking
- Other
- Party
- Religion
- Shopping
- Sports
- Theater
- Wellness
Read More
Score with Alex Sandro: A Guide to Acquiring His FC 24 Showdown Card
Introduction About Alex Sandro Lobo Silva
Alex Sandro Lobo Silva, born on the 26th of...
Roofing Materials Market growth at a rate of 2% forecast to 2029 by Type, Application, Product, Country
The roofing materials market is expected to witness market growth at a rate of 2% in the forecast...
This places you in that offensive group
Before you dive too deeply through the NBA 2K MT guide, we'd suggest you spend some time in the...
All You Need to Know About Bitcoin Mining Pools
The allure of bitcoin (BTC) and the various concepts that arise in the minds of observers...
Data-Driven A/B Testing in Marketing Campaigns
In today's digital landscape, the accomplishment of any marketing strategy greatly relies on...
Sponsored